Chipbond Technology Corporation.

Taiwan · 510 Employees
Chipbond was established in 1997 July 2nd and was booked on the Taiwan Stock Exchange starting from 2002 January 31st. Chipbond Technology Corporation is the only company in Taiwan to supply a true full Turnkey Service for backend assembly processing of LCD driver ICs from wafer bumping to packaging. There are two fabs in operation, the LiHsin Plant and the Prosperity Plant are both located within the Hsinchu Science Park. Wafer bumping is conducted in LiHsin Plant whilst the subsequent backend processing such as testing, dicing and packaging is conducted in the Prosperity Plant. The manufacturing process for driver ICs are different from the standard ICs; they are required to be manufactured by front end foundries' special process, then go through backend production by gold bumping, TCP or COF assembly process. Finally, they are sent to panel houses for final production. In recent years, Taiwan has invested more than 100 billion NTD into the photonics industry in development of TFT-LCD panels and related components. The industry has grown on a phenomenal scale and became the world leader overtaking South Korea; it is expected for the next 10 years, Taiwan will still be the dominant global supplier. As gold bumping providers are losing its profitability and survivability, Driver IC assembly industries are bound for consolidation. Thus Chipbond with its turnkey service will maintain the leading position in Driver IC assembly market, sustaining steady growth.

概述

国家 Taiwan
成立时间 1997
总部 力行五路３號, 新竹市東區科學園區, 300, TW
电话号码 +886512-794-0051
网站 http://www.chipbond.com.tw
LinkedIn http://www.linkedin.com/company/chipbond%e9%a0%8e%e9%82%a6%e7%a7%91%e6%8a%80
Twitter
Facebook
员工数 510
行业 electrical/electronic manufacturing,
简介 Chipbond was established in 1997 July 2nd and was booked on the Taiwan Stock Exchange starting from 2002 January 31st. Chipbond Technology Corporation is the only company in Taiwan to supply a true full Turnkey Service for backend assembly processing of LCD driver ICs from wafer bumping to packaging. There are two fabs in operation, the LiHsin Plant and the Prosperity Plant are both located within the Hsinchu Science Park. Wafer bumping is conducted in LiHsin Plant whilst the subsequent backend processing such as testing, dicing and packaging is conducted in the Prosperity Plant. The manufacturing process for driver ICs are different from the standard ICs; they are required to be manufactured by front end foundries' special process, then go through backend production by gold bumping, TCP or COF assembly process. Finally, they are sent to panel houses for final production. In recent years, Taiwan has invested more than 100 billion NTD into the photonics industry in development of TFT-LCD panels and related components. The industry has grown on a phenomenal scale and became the world leader overtaking South Korea; it is expected for the next 10 years, Taiwan will still be the dominant global supplier. As gold bumping providers are losing its profitability and survivability, Driver IC assembly industries are bound for consolidation. Thus Chipbond with its turnkey service will maintain the leading position in Driver IC assembly market, sustaining steady growth.

技术

ASP.NET

Frameworks and Programming Languages

Microsoft-IIS

Load Balancers

常见问题

Chipbond Technology Corporation. 在哪里?

Chipbond Technology Corporation. 的总部位于 力行五路３號, 新竹市東區科學園區, 300, TW

Chipbond Technology Corporation. 的电话号码是多少?

Chipbond Technology Corporation. 的电话号码是 +886512-794-0051

Chipbond Technology Corporation. 的官方网站是什么?

Chipbond Technology Corporation. 的公司官方网站是 http://www.chipbond.com.tw

Chipbond Technology Corporation. 是做什么的?

Chipbond Technology Corporation. 的业务有哪些?

ic

Chipbond Technology Corporation. 的年收入是多少?

Chipbond Technology Corporation. 的收入是 0美元

Chipbond Technology Corporation. 有多少员工?

Chipbond Technology Corporation. 有 510 名员工

Chipbond Technology Corporation. 属于哪个行业?

Chipbond Technology Corporation. 从事以下行业: electrical/electronic manufacturing

Chipbond Technology Corporation. 使用什么技术?

Chipbond Technology Corporation. 使用的一些流行技术包括: ASP.NET,Microsoft-IIS

如何联系 Chipbond Technology Corporation.?

Chipbond Technology Corporation. 联系信息: 电话号码:+886512-794-0051， 网站:http://www.chipbond.com.tw， 邮箱：rog***@***.***.tw

Chipbond Technology Corporation. 的社交媒体链接是什么?

Chipbond Technology Corporation. 领英：http://www.linkedin.com/company/chipbond%e9%a0%8e%e9%82%a6%e7%a7%91%e6%8a%80,fackbook：,twitte:

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不是

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暂无最近投资信息

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管理层

Roger Lo

Senior Chief Engineer

Arthur Pan

Sr. Program Manager

Max Hsiao

Senior Department Manager

Ferdinand Fangon

Deputy Technical Manager, Engineering Service

Yiszu Yeh

Sales Senior Project Section Manager

员工

John Espallardo

Chief Process Engineer (WLCSP Wet Clean -Strip, Etch, Ball Placement)

Vivien Tseng

採購副處長

Jayson Floranda

Test Development Engineer

Shane Lin

Human Resource Chief Officer

Bing-Yi Chang

Process Engineer

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