Dedi Hemo

Asis- Pro - Embedded Computing Solutions (TIG)

Asis-Pro designs and manufactures embedded computing systems, backplanes, hardware and software solutions for advancedTCA, mTCA, CompactPCI, and custom applications. Established in 1998, the company has been serving the telecom, enterprise, defense, aerospace, high-energy-pysics and industrial markets, bringing innovations in high-speed interconnect and thermal modeling that exceed the standard in performance and reliability. Asis‑Pro, as TI-Group's R&D, arm to provide creative solutions and services that combine vast experience and proven building blocks from its global competitive and challenging environment. Selected by Intel to co-develop the market's first ATCA chassis, Asis has a long history of innovation and excellence. Our engineers are considered world experts in the field of thermal and fluid dynamics, PCB design, and chassis management, constantly raising the bar and setting new market standards. Asis offers the industry's largest product portfolio, covering both AC and DC configurations in a variety of form factors, backplane speeds, and cooling capacities. Our new 40GB product line, Maxum, is the world's first ATCA chassis designed for next-generation virtualization and LTE applications, offering extremely high power and cooling capabilities and the option to decouple the central management, storage, and switching from the blades, pre-integrating them on the chassis itself. Asis is a member of the Trans Innovation Group, a leading provider of electronic components, cable assemblies, and electrical accessories. Our global presence includes sales offices in the US and a worldwide network of distributors and representatives.