电子邮件 | jim***@***.com | 获取Email |
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电子邮件 | jim***@***.com | 获取Email |
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SignForm Systems offers the world's first compression thermoforming system for manufacturing custom Architectural and ADA/DDA Compliant Signage. Our evolving portfolio of creative thermoformed products have led to a dramatic increase in Division 10 specifications. SignForm presses are designed and built exclusively for Architectural Sign Makers to fabricate the most versatile, sustainable and functional tactile signage available today. The Advantages of Thermoforming: 1) Compression Thermoformed ADA Signage is manufactured at a fraction of the time and cost of photopolymer. 2) Economy of Scale: The cost of manufacturing repeats (multiples of same sign) drops significantly and can lower finished cost to under $0.10 p/sq.in. 3) There are no licenses, fees or IP impediments to bring thermoforming in-house. 4) Compression Thermoformed signs are monolithic, making them nearly indestructible! 5) The process involves no adhesives, chemicals or costly water disposal. 6) Energy consumption is less than virtually all other methods. 7) Old or overstock plastic inventory can be formed into new signs and generate fresh revenue. 8) All scrap, off-cuts, old or unused signs can be reintroduced into the system, even if finished or painted. This includes remakes or even signs made from photopolymer, applique, etc. 9) With 100% reintroduction possible, thermoformed signs can function for decades as new signage, regardless of how many times the sign changes. Theoretically, the same material can be sustained for hundreds of years in the same facility. 10) SignForm Systems offers a 100% post-consumer recycled plastic material "EnviroStrate" for blanks and a reinforced shatter-proof aluminum alternative for regulatory Traffic Signs
公司 | SignForm Systems |
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职位 | Director | Developer SignForm Systems |
地点 | United States |
http://www.linkedin.com/in/jim-chapman-4a459b20 | |
部门 | master_engineering_technical,master_information_technology |
头衔 | Director | Developer SignForm Systems |
Ecostrate SFS Co-Founder, Chief Technology Officer, Lead Developer
2012-05-01 - 2014-04-01
SignForm Systems Director | Developer SignForm Systems
2008-09-01 -
Thermoforming Research and Product Development
2005-09-01 - 2007-10-01
Nova Polymers, Inc. Founder, President & CEO
1998-06-01 - 2005-09-01
Technical Sales Manager - Director of Product Development
1991-04-01 - 1998-06-01
Jim Chapman 在 SignForm Systems 担任 Director | Developer SignForm Systems
Jim Chapman 在 SignForm Systems 的职位是 Director | Developer SignForm Systems
Jim Chapman 的电子邮件地址是 jim***@***.com
Jim Chapman 的电话号码是 -
Jim Chapman 的公司电话号码是 +185****
Jim Chapman 在 architecture & planning 工作。
Jim Chapman 的一些同事包括Jim Chapman、。
Jim Chapman联系方式: 电子邮件地址:jim***@***.com 电话号码:-
Jim Chapman 的个人领英是:http://www.linkedin.com/in/jim-chapman-4a459b20
Jim Chapman 的办公地点:648 Bridgeton Pike, Mantua, NJ 08051, US
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