电子邮件 | ema***@***.com | 获取Email |
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电子邮件 | ema***@***.com | 获取Email |
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The alteration and testing of microelectronic components to increase reliability, mitigate tin whiskers, or achieve RoHS compliance. Services include: robotic hot solder dip, column attach, ball grid array (BGA) to column grid array (CGA) conversions, ball attach, BGA reballing, and trim & form. Testing includes: solderability, fine & gross leak, bond pull, ball shear, XRF, failure analysis, and mark permanency. Products include BGA preforms for ball attach or reballing.
公司 | Six Sigma |
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职位 | Lean Six Sigma |
地点 | India |
http://www.linkedin.com/in/lean-six-sigma-9000a2171 | |
部门 | |
头衔 | Lean Six Sigma at Six Sigma |
Lean Sigma 在 Six Sigma 担任 Lean Six Sigma at Six Sigma
Lean Sigma 在 Six Sigma 的职位是 Lean Six Sigma at Six Sigma
Lean Sigma 的电子邮件地址是 ema***@***.com
Lean Sigma 的电话号码是 -
Lean Sigma 的公司电话号码是 +140****
Lean Sigma 在 semiconductors 工作。
Lean Sigma 的一些同事包括Mahmoud Yaghi、Rahimhameed Hameed、Abigail Coleman、Indu EMadhavan Murali、。
Lean Sigma联系方式: 电子邮件地址:ema***@***.com 电话号码:-
Lean Sigma 的个人领英是:http://www.linkedin.com/in/lean-six-sigma-9000a2171
Lean Sigma 的办公地点:905 Montague Expressway, Milpitas, California, USA, 95035
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