Bo Zheng

Tsinghua Unigroup

Tsinghua Unigroup, China's leading semiconductor, digital infrastructure and services provider, focused on the intelligent design and manufacture of technology used by business and consumers every day. Guided by its "chip to cloud" strategy, the group has established extensive presence covering the entire industry value chains, from semiconductor design and production, to manufacture of network equipment, server and storage, system integration, network security and software applications. Tsinghua Unigroup supports utilization of next-generation technologies, including 5G, IoT and AI, and operates. Some of its key subsidiaries include Unisoc Communications Co., a mobile and IoT core chip designer; New H3C Technologies Co., a leading digital solutions provider; Unigroup Guoxin Microelectronics Co., a leader in security chips; Unicloud Technology Co., a digital partner with strong track record; and Yangtze Memory Technologies Co., a memory chip solution provider. Tsinghua Unigroup was founded in 1988 as a business venture of Tsinghua University. Today, the group is one of China's most successful technology firms, with 60 R&D centers and 130 operational support centers and branches worldwide. Headquartered in Beijing, Tsinghua Unigroup employs over 40,000 people globally.