Boschman Advanced Packaging Technology

Netherlands · 83 Employees
Boschman Advanced Packaging Technology, a solution driven company serving the semiconductor assembly industries worldwide Boschman Advanced Packaging Technology is an experienced and dynamic high-tech company serving the global semiconductor assembly industry providing quality solutions for specific market segments, Mems & Sensors, Smartcards and Powers. Boschman Advanced Packaging Technology is founded in 1990 and the head quarter is based in The Netherlands in a modern, well-equipped facility. Molding and Sinter Systems Our molding and Ag-Sinter systems are developed at our systems R&D facility in the Netherlands. Mechanical, electrical, software, process and mold/tool-design experts work in multi-disciplinary teams to realize the best possible total system solution. Our researcher's and designer's long-term technical and field experience is further enhanced by direct end-user interaction. Systems are produced, assembled and tested at our facility in Singapore. Opened in 1997, this production site has gradually developed local capabilities for the manufacturing of our molding and sinter systems. Aside from an experienced production staff, we have local mechanical, electrical, software and process engineers available to ensure and maintain the highest possible production quality. Materials and parts used in our molding systems are carefully selected and tested on the basis of functionality, safety, availability and especially sustainability.

概述

国家 Netherlands
成立时间 1987
总部 3 stenograaf, duiven, gelderland, netherlands
电话号码 +31 26 3194900
网站 http://www.boschman.nl
LinkedIn http://www.linkedin.com/company/boschman-technologies-b-v-
Twitter
Facebook https://www.facebook.com/Boschmanpackaging
员工数 83
行业 semiconductors,
简介 Boschman Advanced Packaging Technology, a solution driven company serving the semiconductor assembly industries worldwide Boschman Advanced Packaging Technology is an experienced and dynamic high-tech company serving the global semiconductor assembly industry providing quality solutions for specific market segments, Mems & Sensors, Smartcards and Powers. Boschman Advanced Packaging Technology is founded in 1990 and the head quarter is based in The Netherlands in a modern, well-equipped facility. Molding and Sinter Systems Our molding and Ag-Sinter systems are developed at our systems R&D facility in the Netherlands. Mechanical, electrical, software, process and mold/tool-design experts work in multi-disciplinary teams to realize the best possible total system solution. Our researcher's and designer's long-term technical and field experience is further enhanced by direct end-user interaction. Systems are produced, assembled and tested at our facility in Singapore. Opened in 1997, this production site has gradually developed local capabilities for the manufacturing of our molding and sinter systems. Aside from an experienced production staff, we have local mechanical, electrical, software and process engineers available to ensure and maintain the highest possible production quality. Materials and parts used in our molding systems are carefully selected and tested on the basis of functionality, safety, availability and especially sustainability.

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常见问题

Boschman Advanced Packaging Technology 在哪里?

Boschman Advanced Packaging Technology 的总部位于 3 stenograaf, duiven, gelderland, netherlands

Boschman Advanced Packaging Technology 的电话号码是多少?

Boschman Advanced Packaging Technology 的电话号码是 +31 26 3194900

Boschman Advanced Packaging Technology 的官方网站是什么?

Boschman Advanced Packaging Technology 的公司官方网站是 http://www.boschman.nl

Boschman Advanced Packaging Technology 是做什么的?

Boschman Advanced Packaging Technology 的业务有哪些?

package development,ag sintering,transfer molding,mems,sensors,power modules

Boschman Advanced Packaging Technology 的年收入是多少?

Boschman Advanced Packaging Technology 的收入是 0美元

Boschman Advanced Packaging Technology 有多少员工?

Boschman Advanced Packaging Technology 有 83 名员工

Boschman Advanced Packaging Technology 属于哪个行业?

Boschman Advanced Packaging Technology 从事以下行业: semiconductors

Boschman Advanced Packaging Technology 使用什么技术?

Boschman Advanced Packaging Technology 使用的一些流行技术包括: CloudFlare Hosting,Cloudflare DNS,Google Font API,Google Maps,Google Tag Manager,Gravity Forms,Microsoft Office 365,Mobile Friendly,Outlook,SendInBlue,Sendgrid,WordPress.org,reCAPTCHA

如何联系 Boschman Advanced Packaging Technology?

Boschman Advanced Packaging Technology 联系信息: 电话号码:+31 26 3194900， 网站:http://www.boschman.nl， 邮箱：ema***@***.com

Boschman Advanced Packaging Technology 的社交媒体链接是什么?

Boschman Advanced Packaging Technology 领英：http://www.linkedin.com/company/boschman-technologies-b-v-,fackbook：https://www.facebook.com/Boschmanpackaging,twitte:

Boschman Advanced Packaging Technology 是一家上市公司吗?

不是

Boschman Advanced Packaging Technology 的最后一轮融资是什么时候?

暂无最近投资信息

谁投资 Boschman Advanced Packaging Technology?

Boschman Advanced Packaging Technology 有 0 家投资者,包括 。

管理层

Eric Stelt

International Service Manager

Mike Hoedemaker

Lead Engineer Package Development, Film Assisted Molding Specialist

Joost Wolf

Head of CAM and Milling, CNC Milling Machinist, CNC Milling Programmer, CAM Programmer

Frank Boschman

Managing Director

Jason Boyd

Manager - Organisational Quality(QA) + Assembly Services

员工

Edwin Papen

Engineering

Egbert Berg

Technician

Lingen Wang

research engineer

Thomas Kievit

Internal Service Coordinator

Robert Langeler

Boekhouder

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