电子邮件 | jas***@***.nl | 获取Email |
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电子邮件 | jas***@***.nl | 获取Email |
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Boschman Advanced Packaging Technology, a solution driven company serving the semiconductor assembly industries worldwide Boschman Advanced Packaging Technology is an experienced and dynamic high-tech company serving the global semiconductor assembly industry providing quality solutions for specific market segments, Mems & Sensors, Smartcards and Powers. Boschman Advanced Packaging Technology is founded in 1990 and the head quarter is based in The Netherlands in a modern, well-equipped facility. Molding and Sinter Systems Our molding and Ag-Sinter systems are developed at our systems R&D facility in the Netherlands. Mechanical, electrical, software, process and mold/tool-design experts work in multi-disciplinary teams to realize the best possible total system solution. Our researcher's and designer's long-term technical and field experience is further enhanced by direct end-user interaction. Systems are produced, assembled and tested at our facility in Singapore. Opened in 1997, this production site has gradually developed local capabilities for the manufacturing of our molding and sinter systems. Aside from an experienced production staff, we have local mechanical, electrical, software and process engineers available to ensure and maintain the highest possible production quality. Materials and parts used in our molding systems are carefully selected and tested on the basis of functionality, safety, availability and especially sustainability.
公司 | Boschman Advanced Packaging Technology |
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职位 | Manager - Organisational Quality(QA) + Assembly Services |
地点 | Netherlands |
http://www.linkedin.com/in/boydjason | |
部门 | master_engineering_technical,master_information_technology |
头衔 | Manager - Organisational Quality(QA) + Assembly Services |
Boschman Advanced Packaging Technology Manager - Organisational Quality(QA) + Assembly Services
2023-01-01 -
Boschman Advanced Packaging Technology Manager - Assembly Services
2020-01-01 - 2023-01-01
Electronic Engineering Specialist
2019-11-01 - 2020-01-01
Kulicke & Soffa Staff Global Field Application Engineer
2015-01-01 - 2019-11-01
Kulicke & Soffa Senior Manufacturing Technology Consultant
2010-06-01 - 2015-01-01
Jason Boyd 在 Boschman Advanced Packaging Technology 担任 Manager - Organisational Quality(QA) + Assembly Services
Jason Boyd 在 Boschman Advanced Packaging Technology 的职位是 Manager - Organisational Quality(QA) + Assembly Services
Jason Boyd 的电子邮件地址是 jas***@***.nl
Jason Boyd 的电话号码是 -
Jason Boyd 的公司电话号码是 +312****
Jason Boyd 在 semiconductors 工作。
Jason Boyd 的一些同事包括Edwin Papen、Eric Stelt、Mike Hoedemaker、Joost WolfFrank Boschman、。
Jason Boyd联系方式: 电子邮件地址:jas***@***.nl 电话号码:-
Jason Boyd 的个人领英是:http://www.linkedin.com/in/boydjason
Jason Boyd 的办公地点:3 stenograaf, duiven, gelderland, netherlands
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